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04

Polymers, Resins & High-Performance Materials

Products

Advanced polymers and resins for adhesives, coatings and functional materials, including heat-resistant grades for aerospace and automotive use.

Products 04

Applications

Adhesives, coatings and composites
Aerospace, automotive and industrial materials
Custom formulations for industrial and research use

The range

Grades in this group

PolyimideHigh-temperature polymer for flexible circuits, films and parts in continuous thermal service.
4,4′-(Hexafluoroisopropylidene)diphthalic anhydride6FDA: fluorinated dianhydride for soluble, low-dielectric polyimides and gas-separation membranes.
4,4′-OxydianilineODA: aromatic diamine paired with dianhydrides in classical polyimide synthesis.
PolybenzimidazolePBI resin for compression-moulded parts and high-temperature membranes and fibres.
Polyether Ketone KetonePEKK: high-temperature PAEK with a tunable melt window for composites and additive manufacture.
PolyetherimidePEI: amorphous high-heat thermoplastic with inherent flame retardance and dimensional stability.
Hexafluoroisopropylidene BisphenolBisphenol AF: fluorinated monomer for fluoroelastomer cure systems and high-performance polymers.
3,3′,4,4′-Biphenyltetracarboxylic dianhydrideBPDA: rigid dianhydride for low-expansion polyimide films and coatings.
Pyromellitic DianhydridePMDA: the classical dianhydride for thermally stable polyimides, epoxies and curing agents.
4,4′-Diaminodiphenyl SulfoneDDS: high-temperature epoxy curing agent for aerospace prepregs and structural composites.
3,3′-Diaminodiphenyl sulfoneMeta-isomer curing agent giving epoxy systems a longer pot life and greater toughness.

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